ASML took nine years between first EUV shipment and high-volume production
John Bathgate · Complexity Investing & Semiconductors with NZS Capital (Extended Cut) · Acquired · Nov 3, 2021 · at 1:40:07
John Bathgate describes the decade-long learning cycle ASML and TSMC required to make EUV lithography economically viable.
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“They shipped the first EUV tool in 2010 to TSMC, and EUV didn't even really start high volume, and this was after, you know, a decade of R&D already, but then they didn't start high volume manufacturing on EUV until 2019. So they had, like, almost a decade of learnings in TSMC's fabs on, like, how to get these things to actually work”
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